Sponsor: Tegal Corporation
Speaker: Paul Werbaneth, VP Marketing
Recording: please click here to view
Slides: please email Paul Werbaneth at pwerbane@tegal.com to request a copy of the slides
* Observations on market requirements (e.g. wafer diameter distribution between 300mm, 200mm, 150mm) for silicon DRIE processes
* Review of Bosch process for silicon DRIE
* Review of Bosch process alternatives for silicon DRIE, with examples from the literature
* Tegal super high aspect ratio silicon DRIE process
* Observations on commercial applications for super high aspect ratio silicon DRIE (e.g. Passive Devices, Power Devices, Analog, Linear, and Mixed Signal Devices)
About the sponsor:
Tegal Corporation designs, manufactures, markets and services best-of-breed Deep Reactive Ion Etching (DRIE) systems for the fabrication of advanced MEMS, power ICs and optoelectronic devices found in products like smart phones, digital cameras and imagers, and GPS units. Tegal combines proven expertise with practical system strategies to deliver application-specific DRIE solutions that are robust and reliable, and deliver exceptional process quality and high yields at a lower overall cost of ownership. Headquartered in Petaluma, California, and with a development center in Annecy, France, Tegal has more than 35 years of expertise and innovation in specialized plasma etch technologies. For more information, please go to: http://www.tegal.com.